ICSMA 19 is part of a traditional conference series organized every third year since 1967, so more than 50 years. It provides a comprehensive coverage on the research progress in the field of material strength. ICSMA is forging the interface between the mechanics and materials science communities by uniting the research forces to improve material performance. This conference is an international forum for exchanging on material strength of all engineering materials; from solid to bio-materials, from nanoscale to real size structures. The latest achievements obtained in experiments, characterization, simulation and modeling, as well as new applications for technology transfer will be presented and discussed. The Laboratory of Excellence “DAMAS” (Design of Alloy Metals for low-mAss Structures) of the Université de Lorraine and CNRS is in charge of the organization. The conference will be held in Metz, a thrilling city of France, where art and science is living in harmony since two thousand years.

LIST OF TOPICS AND SYMPOSIA
(not exhaustive list):

• Characterization of deformation processes
• Elementary deformation mechanisms in engineering materials
• Fracture and fatigue
• Friction and wear
• Composite materials
• Glasses and non-crystalline solids
• High temperature deformation and creep
• Materials under extreme conditions
• Mechanical behavior associated with phase transformations
• Mechanistic foundations for multiscale modeling
• Integrated computational materials engineering
• Micro- and nano-scale mechanical testing
• Effects of grain boundaries and interfaces
• Reinforcements at the sub-nanometer scale
• Strength of biomedical and bio-inspired materals
• Mechanical behaviour of high entropy alloys
• Light weighting of structures
• Tamas UNGAR Honorary Symposium (organizer: Gabor Ribarik)
• Symposium on SPD Materials (organizer: Hyong Seop Kim)
• Symposium on Composition-Aware Plasticity Mechanisms in Alloys (organizer: Anter El-Azeb)
• Atul CHOKSHI Honorary Symposium (organizers: Satyam Suwas, Praveen Kumar)
• Alain JACQUES † Honorary Symposium (organizer: Thomas Schenk)
• Other topic