26 juillet 2020 -
31 juillet 2020 / Columbus

Congrès

ICTP 2020 – 13th International Conference on the Technology of Plasticity

From fundamental science to industrial application, the breadth of the metal forming community will convene at The 13th International Conference on the Technology of Plasticity (ICTP 2020). Scientists and engineers from across industry, academia, and government will share their latest improvements and innovations in all aspects of metal forming science and technology, with the intent of facilitating linkages and collaborations among these groups.

This conference will provide a forum for presentations and discussions on all areas related to the plastic deformation of materials to create components. Topics of particular interest include, but are not limited to:

  • Metal Forming Processes & Equipment
  • Joining by Forming and Deformation
  • Microstructure and Damage Development & Characterization
  • Big Data and Metal Forming
  • High Speed and Impulse Forming
  • Agile Metal Forming
  • Microstructure Development by Forming
  • Technologies to Speed Innovation
  • Value of, and Limits to, Simulation

Site internet de l’évènement

https://www.tms.org/ICTP2020

organisateur

TMS - The Minerals, Metals & Materials Society

date

26 juillet 2020 -
31 juillet 2020

Lieu

Ohio Union at The Ohio State University
1739 N. High Street, Columbus
Etats-Unis

Contacts

TMS Meeting Services
5700 Corporate Drive Suite 750
Pittsburgh, PA 15237
Telephone: +1-724-776-9000
Fax: 1-724-776-3770
E-mail: mtgserv@tms.org

Date limite de soumission

16/09/2019