Processing of copper-oxide films and their advanced characterisation by resistive-nanoindentation
5-6 months, starting ideally in February 2021
Personnes à contacter par le candidat
Fabien Volpi : firstname.lastname@example.org ;
Morgan Rusinowicz : email@example.com ;
Muriel Braccini : firstname.lastname@example.org
DATE DE DÉBUT SOUHAITÉ
DATE LIMITE DE CANDIDATURE
The internee will carry out two complementary tasks:
– Processing : performing low temperature oxidation treatments (150-300°C) of annealed pure copper samples. Microstructural characterizations (Scanning Electron Microscopy (SEM), X-Ray Diffraction, Raman spectroscopy, ellipsometry,…) will be carried out to identify the nature of the oxides (Cu2O and/or CuO), the thickness and the microstructure of the layers.
-Advanced characterisations: Mechanical and electrical characterisations of the oxide films. For this task, the resistive-nanoindentation technique will be used.
Another objective of this internship will be to establish the relationship between elaboration conditions (temperature and oxidation time), the obtained microstructures (nature of the oxide, thickness of the layers, grain size, porosities…) and the resulting mechanical and electrical properties.
Student profile: Master 2 level (or 5th year of engineering school) in a material science program.
To candidate, please send your resume and application letter to the contacts.