New insights in the reduced mobility description for the modeling of grain growth and recrystallization at the polycrystalline scale


MINES Paris CEMEF, 06904 Sophia Antipolis,

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Understanding and predicting microstructure evolutions are nowadays a key to the competitiveness of industrial companies, with direct economic and societal benefits in all major economic sectors (aerospace, nuclear, renewable energy, naval, defence, and automotive industry).

Multiscale materials modeling, and more precisely simulations at the mesoscopic scale, constitute the most promising numerical framework for the next decades of industrial simulations as it compromises between the versatility and robustness of physicallybased models, computation times, and accuracy. The DIGIMU consortium and the RealIMotion ANR Industrial Chair are dedicated to this topic at the service of major industrial companies.

In this context, the efficient and robust modeling of evolving interfaces like grain boundary networks is an active research topic, and numerous numerical frameworks exist. In the context of hot metal forming and when large deformation of the calculation domain and the subsequent migration of grain boundary interfaces are involved, only few approaches remain efficient.

Moreover, the discussion of the classical kinetic equations used at the mesoscopic scale to describe the relation between the driving pressures acting on the grain boundaries and their resulting motion is more and more discussed [4,5]. This PhD will be dedicated to the enrichment of existing full-field front-capturing and front-tracking methods to integrate some new capabilities such as the use of a tensorial reduced mobility description, a better integration of torque terms in 2D and 3D and a disconnectionbased description of the involved mechanisms. The developments will be validated thanks to pre-existing experimental and numerical data concerning the evolution of grain boundary interfaces during recrystallization and related phenomena for different materials. They will also be integrated in the DIGIMU® software.